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Alcohol-based flux
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Alcohol-based flux
Alcohol-based fluxes have a very wide range of applications. The fluxes have very good soldering properties, in particular with the step-through and the wetting of the circuit board. The process window is very wide, with high thermal stability and good process activity over a long time interval. The residue behavior is also very good, the circuit boards are very clean after the soldering process.
| Product | Solids content | Application area | Activators |
|---|---|---|---|
| EO-B-001A (Multiflux) | 2.2 Gew.-% | Wave- and selective soldering, manual- and repair soldering, dip soldering | di-carboxylic acids, low resin content |
| EO-B-001B (Multiflux) | 3.0 Gew.-% | Wave- and selective soldering, manual- and repair soldering, dip soldering | di-carboxylic acids, low resin content |
| EO-B-001C (Multiflux) | 4.0 Gew.-% | Wave- and selective soldering, manual- and repair soldering, dip soldering | di-carboxylic acids, low resin content |
| EO-B-002A (Multiflux) | 2.0 Gew.-% | Wave- and selective soldering, manual- and repair soldering, dip soldering | di-carboxylic acids, very low resin content |
| EO-B-002B (Multiflux) | 3.0 Gew.-% | Wave- and selective soldering, manual- and repair soldering, dip soldering | di-carboxylic acids, very low resin content |
| EO-B-002C (Multiflux) | 4.0 Gew.-% | Wave- and selective soldering, manual- and repair soldering, dip soldering | di-carboxylic acids, very low resin content |
| EO-B-004 (Multiflux) | 1.8 Gew.-% | Wave- and selective soldering, manual- and repair soldering, dip soldering | di-carboxylic acids, very low resin content |
| EO-B-006A (Multiflux) | 2.0 Gew.-% | Wave- and selective soldering, manual- and repair soldering, dip soldering | non-halogen, di-carboxylic acids, no resin content |
| EO-B-006B (Multiflux) | 3.0 Gew.-% | Wave- and selective soldering, manual- and repair soldering, dip soldering | non-halogen, di-carboxylic acids, no resin content |
| EO-B-006C (Multiflux) | 4.0 Gew.-% | Wave- and selective soldering, manual- and repair soldering, dip soldering | non-halogen, di-carboxylic acids, no resin content |
| EO-B-007A (Multiflux) | 1.9 Gew.-% | Wave- and selective soldering, manual- and repair soldering, dip soldering | di-carboxylic acids, very low resin content |
| EO-B-007B (Multiflux) | 3.0 Gew.-% | Wave- and selective soldering, manual- and repair soldering, dip soldering | di-carboxylic acids, very low resin content |
| EO-B-007C (Multiflux) | 4.0 Gew.-% | Wave- and selective soldering, manual- and repair soldering, dip soldering | di-carboxylic acids, very low resin content |
| EO-B-008 (Multiflux) | 4.0 Gew.-% | Wave- and selective soldering, manual- and repair soldering, dip soldering | di-carboxylic acids, low resin content |
| EO-B-009A (Multiflux) | 2.0 Gew.-% | Wave- and selective soldering, manual- and repair soldering, dip soldering | di-carboxylic acids, no resin content |
| EO-B-009B (Multiflux) | 3.0 Gew.-% | Wave- and selective soldering, manual- and repair soldering, dip soldering | non-halogen, di-carboxylic acids, no resin content |
| EO-B-009C (Multiflux) | 4.0 Gew.-% | Wave- and selective soldering, manual- and repair soldering, dip soldering | non-halogen, di-carboxylic acids, no resin content |
| EO-B-010C (Multiflux) | 4.0 Gew.-% | Wave- and selective soldering, manual- and repair soldering, dip soldering | di-carboxylic acids, synthetic resin complex |
| GSP-2533/RX | 2.5 Gew.-% | Wave soldering (spray- and foam fluxing) | synthetic resin with di-carboxylic acids |
| GSP-2533/RX/OVAP | 2.5 Gew.-% | Wave soldering (spray fluxing) | synthetic resin with di-carboxylic acids |
| HR/D-110 | 5.8 Gew.-% | Wave- and selective soldering, manual- and repair soldering, dip soldering | di-carboxylic acids, resins |
| PM-334 | 3.0 Gew.-% | Wave- and selective soldering, manual- and repair soldering, dip soldering | di-carboxylic acids, minimal resin content |
| RS-4004 | 3.5 Gew.-% | Wave- and selective soldering, manual- and repair soldering, dip soldering | di-carboxylic acids, minimal resin content |
| S-250/FR | 2.5 Gew.-% | Wave soldering (spray- and foam fluxing) | synthetic resin with di-carboxylic acids |
| S-250/FRO | 2.5 Gew.-% | Wave soldering (spray fluxing) | di-carboxylic acids with synthetic resin |
| Solder Tincture WFF | approx. 38 Gew.-% | Manual-, repair- and dip soldering, soldering on ceramic substrates, strand tinning | Balsamic resin, di-corboxylic acids, halogenated amine |
| SSK-15 | 15.0 Gew.-% | Manual- and repair soldering, dip soldering | di-carboxylic acids, resins |
Samme produkter
Water-based flux |
Alcohol and water based flux |
E-mail: 
Telefon: +47 90631750