• Easily substituted into existing Pb-free processes
• Comparable reliability to SAC305 and SnPb eutectic
  • Superior drop shock resistance
  • Maintains thermal cycling reliability with Mn

Current Industry Dilemma:

Conventional SAC alloys exist with an inherent trade-off between thermal cycling reliability (TCR) and drop shock resistance (DSR). High Ag versions do not live up to the expectations of SnPb DSR, whereas low Ag versions offer improved DSR, but lose TCR.

The Solution:

With the addition of Mn, SACm^™does not compromise on reliability. The combination of low Ag, for lower material costs and improved TCR over other low Ag alloys, integrates easily into existing Pb-free processes.

The Details:

SACm^™ is comprised of 97.5-98.5% Sn, 0.5-1.0% Ag, and 0.5-1.0% Cu, with dopant levels of Mn. This alloy is available in solder spheres as well as powder (T3, T4, and T4.5) and solder paste.

Watch the video: http://www.indium.com/solder-paste-and-powders/SACm/video/index.php