Indium Corporation manufactures a wide variety of alloys that range from high temperature Au-based solders to low temperature indium- and bismuth-based solders.
High temperature solders include gold (Au), gold-tin (AuSn), gold-silicon (AuSi), and gold-germanium (AuGe). Alloys that melt at over 270°C are considered brazing alloys.
Gold-based alloys are used in high reliability applications, such as hermetic sealing, aerospace, and medical. These alloys have a high tensile strength, superior thermal fatigue resistance, exceptional thermal conductivity, as well as resistance to corrosion and oxidation.
Low temperature solders include indium- and bismuth-containing alloys such as bismuth-tin (BiSn). They are available as solder preforms, solder paste, solder wire, ingot, or solder ribbon. Applications for low temperature alloys include:
- soldering temperature sensitive components
- step soldering
- soldering LEDs
Indium-containing alloys can be used for cryogenic applications, TCE mismatch, and applications that need improved thermal fatigue performance.
Bismuth-containing solders can be used for fusible links, such as fuses, sprinkler heads, or blow-out valves.
Indium Corporation also manufactures solders that are liquid at room temperature. Also referred to as liquid metal, these gallium-containing solders can melt at temperatures as low as 7°C. Liquid metals are available in a syringe or bottle.
To select the right alloy for your application, contact one of our technical support engineers.
BiAgX® |
SACm |
Leading Lead-Free solder pastes |
Tin-Lead |