Indium8.9 - Solder Paste Eliminates HiP
Key Features:
•Strong oxidation barrier to promote coalescence after heat exposure
•High tackiness to maintain contact with components
•Clear probe-testable flux residue
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Indium8.9HF - Solder Paste Best All-around Halogen-free Paste
Key Features:
•Strong oxidation barrier promotes complete coalescence
•Resists premature flux spread to prevent surfaces from oxidizing
•Probe testable
•Halogen-free
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Indium8.9HF-1 - Solder Paste Enables In-circuit Probe Testing
Key Features:
•Thermally stable residue designed to stay probe-testable
•Fewer false testing failures mean quicker cycle times and less rework
•Halogen-free
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Indium8.9HFA - Solder Paste Delivers Superior Printing for Miniaturization
Key Features:
•Best-in-class high speed printing
•Optimal print performance for the smallest components and apertures
•Halogen-free and Pb-free
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Indium10.1 - Solder Paste Best All-around Halogen-containing Paste
Key Features:
•Lowest levels of voiding for QFNs, BGAs, and CSPs
•Oxidation inhibition promotes complete coalescence after long reflow profiles
•Excellent HIP, graping performance
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BiAgX® |
SACm |
Tin-Lead |
Package-on-Package paste |