No other metal is as versatile as indium metal. In its various forms it can be used for:
  •  Sealing in cryogenic applications - stays malleable and ductile below -150°C
  •  Soldering or fusing applications - melts at temperatures ranging from 6.5°C to 310°C
  •  High-end device cooling - reduces operating temperatures by up to 10°C
Benefits of Using Indium for Solder and Sealing
  •  Indium is ductile and malleable which allows it to deform and fill in the uneven microstructure of two mating parts, using only moderate pressure.
  •  This ductility and malleability is retained at cryogenic temperatures so that an assembly can maintain an effective seal, even in harsh environments.
  •  With a relatively high thermal conductivity of 86W/mK @ 85°C, indium is widely used in thermal management applications to dissipate the heat produced by electronic components.
  •  Indium compensates for different coefficients of thermal expansion (CTE) when bonding dissimilar parts.
  •  Even in small percentages, indium can improve the thermal fatigue performance of solders used in electronics assembly.
  •  Several indium-containing alloys melt at temperatures less than 180°C, making them ideal for step soldering or applications that require lower reflow temperatures.
  •  Indium has a low vapor pressure, making it suitable for use in high vacuum applications.
  •  Indium alloys enable solders to withstand drop tests better than other low melting alloys.