BiAgX®
BiAgX®
- Drop-in replacement for high-Pb solder paste
- Pb-free and Sb-free
- Solidus > 260°C after reflow
- MSL1 proven per IPC/JEDEC J-STD-020D
Introduction
The Power Semiconductor market has seen a lot of change in the past 10 years. One of the biggest changes to influence this market is the movement toward Pb-free die-attach materials. Indium Corporation has developed a solder paste technology for high Pb-containing applications. This technology, called BiAgX®, creates a solder joint that re-melts at over 260°C.
Features
- Drop-in replacement for high Pb-containing solder pastes, requiring minimal process optimization and no new capital expenditure
- Both Pb-free and Sb-free, conforming to applicable standards
- Available in both dispense and printing forms, like standard die-attach solder paste
- Reflows, solders, and solidifies like other solder paste
- Fluxes are cleanable with standard cleaning chemistry and processes
- Requires minimal adjustments when converting from a standard high-Pb solder paste-based process
- Suited to smaller die and lower voltage applications, such as those used in QFN packages for portable electronics, automotive, and industrial applications
- Contains no costly specialty materials, such as nanoparticles or gold
- Requires no pressure on the die during the reflow process
- Designed to work in high-temperature environments at temperatures in excess of 150°C with no degradation of the mechanical structure or other properties
- Evolving into a family of products, all based around a platform technology
- Patent-pending
Indium Corporation also offers other die-attach solder materials, and is currently the only materials supplier in the Automotive Electronics Council (AEC).
Same products
SACm |
Leading Lead-Free solder pastes |
Tin-Lead |
Package-on-Package paste |