BiAgX®
BiAgX®
  • Drop-in replacement for high-Pb solder paste
  • Pb-free and Sb-free
  • Solidus > 260°C after reflow
  • MSL1 proven per IPC/JEDEC J-STD-020D

 

Introduction

The Power Semiconductor market has seen a lot of change in the past 10 years. One of the biggest changes to influence this market is the movement toward Pb-free die-attach materials. Indium Corporation has developed a solder paste technology for high Pb-containing applications. This technology, called BiAgX®, creates a solder joint that re-melts at over 260°C.

Features

  • Drop-in replacement for high Pb-containing solder pastes, requiring minimal process optimization and no new capital expenditure
  • Both Pb-free and Sb-free, conforming to applicable standards
  • Available in both dispense and printing forms, like standard die-attach solder paste
  • Reflows, solders, and solidifies like other solder paste
  • Fluxes are cleanable with standard cleaning chemistry and processes
  • Requires minimal adjustments when converting from a standard high-Pb solder paste-based process
  • Suited to smaller die and lower voltage applications, such as those used in QFN packages for portable electronics, automotive, and industrial applications
  • Contains no costly specialty materials, such as nanoparticles or gold
  • Requires no pressure on the die during the reflow process
  • Designed to work in high-temperature environments at temperatures in excess of 150°C with no degradation of the mechanical structure or other properties
  • Evolving into a family of products, all based around a platform technology
  • Patent-pending

Indium Corporation also offers other die-attach solder materials, and is currently the only materials supplier in the Automotive Electronics Council (AEC).