FX3 - SUPER HIGH-SPEED MOUNTER

Placement head:
Four multi-nozzle laser heads (total of 24 nozzles)
Placement rate:
60'000 CPH   / 0.06 sec./chip (IPC9850)
Component range:
01005 to 33.5 mm square  (diagonal length of 47mm)
Placement accuracy:
±0.05mm (Cpk ³ 1)
Feeder inputs:
120 single 8mm Tape Feeder

FX1R - HIGH-SPEED CHIP SHOOTER

KE-2050 light - HIGH-SPEED CHIP SHOOTER 

Placement head:
Quadruple head with multi-laser alignment
Placement rate:
13,200 cph (IPC 9850)
Component range:
0201 (inch)
11 x 26.5mm or 20 x 20mm
Placement accuracy:
±50µm (3 Sigma)
 

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KE-2060 light - HIGH-SPEED FLEXIBLE MOUNTER

Placement head:
Quadruple head with laser alignment
1 high-precision placement head vision and laser alignment
Placement rate:
12,500 CPH (laser alignment) accoridng IPC 9850
1,750 CPH (vision centering) accoriding IPC 9850
Component range:
From 0201 (inch) up to 75 x 75 mm or 50 x 150 mm
Component height:
up to 12 mm
Placement accuracy:
Vision centering: ± 30 µm (3 Sigma)
Laser alignment: ± 50 µm (3 Sigma)

KE-2060R - HIGH-SPEED FINE PITCH ASSEMBLER

Placement head:
Quadruple head with multi-nozzle laser alignment and
multi-nozzle vision centering (MNVC - optional)
1 high-precision placement head with
vision and laser alignment
Placement rate:
12,500 cph  (IPC 9850)
3,400 cph Fine-Pitch  (with MNVC)
Component range:
0201 (inch)
High-precision head:
Up to 75 x 75mm or 50 x 150mm
Placement accuracy:
High-precision head (vision centering):
±30µm (3 Sigma)
Laser alignment:
±50µm (3 Sigma)

KE-2070 - HIGH-SPEED CHIP CHOOTER

Placement head:
One multi-nozzle laser head (6 nozzles)
Placement rate:
16,000 CPH: chip (laser centering / IPC 9850)
Component range:
From 0402 (01005) to 33.5mm square components